Name: Electrolytic Flexible RA Copper Sheet Roll
Brand: OEM

Electrolytic Flexible RA Copper Sheet Roll

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Detailed Product Description

Product Name:	Single Shiny Treated RA Cu Foil For PCB With Maximum Width 650mm In Roll	Alloy Number:	C11000
Material:	Red Copper	Shape:	Roll
Density:	8.9g/cm3	Width(Max):	600mm
Thickness:	12μm~100μm	HS Code:	FPC
Alloy Or Not:	Non-alloy
High Light:	600mm Copper Sheet Roll , 100um Copper Sheet Roll , 12um Copper Sheet Roll

Electrolytic Flexible RA Copper Sheet Roll

Dimension Range:

Thickness Range: 12μm~100μm,

Width(Max.): 600mm

Performances:

Applications:

Flexible Copper Clad Laminate(FCCL), Fine Circuit FPC, LED coated crystal thin film.

Features:

The material has higher extensibility, and has a high bending resistance and no crack.

Table 1:FPC T2 high flex rolled copper foil properties (IPC-6542)

Item		Unit	Parameters
Item		Unit	12μm	18μm	25μm	35μm	70μm
Mass per unit(±5%)		g/m²	105	160	300	400	445
Cu+Ag		%	≥99.99
Temper			H	O,H	O,H	O,H	O,H
Surface roughness	Ra	μm	0.13	0.12	0.1	0.08	0.08
Surface roughness	Rz	μm	1.3	1.0	0.8	0.74	0.76
Tensile strength	Normal Temp /23℃	N/mm²	≥430	≥450	≥450	≥450	≥450
Tensile strength	High Temp /220℃	N/mm²	≥140	≥150	≥170	≥210	≥220
Elongation	Normal Temp /23℃	%	≥1.5	≥3.0	≥4.0	≥4.2	≥4.5
Elongation	High Temp /220℃	%	≥8	≥10	≥18	≥28	≥30
Fatigue Resistance (annealed)		%	65	65	65	65	65
Maximum resistivity		Ωmm2/m	0.0181
Electrical conductivity		%	≥98.3%
Film and adhesive layers		Instant Temp. 300℃/10s	Film and adhesive paste after transient temperature without blistering delamination.
Anti oxidation	H.T.(200℃)	Minute	Won’t Change the Color within 60 minutes
Pinhole test results		piece/ m²	Pinhole area more than 0.5 mm²,0.005 piece/ m²