Beijing Silk Road Enterprise Management Services Co.,LTD
Beijing Silk Road Enterprise Management Services Co.,LTD
|
Product Details:
Payment & Shipping Terms:
|
| Application: | Electronics | Shape: | Lump |
|---|---|---|---|
| Material: | Copper | Chemical Composition: | 9990 |
| Color: | RED | Standard: | ASTM/GB/DIN/JIS/ISO |
| Surface: | Bright | Thick: | 8um/9um/12um |
| High Light: | 8um RA Copper Foil,9um RA Copper Foil,12um RA Copper Foil |
||
Shielding RA Copper Foil
Description:
Shielding Copper Foil Made of pure copper, copper grade T2(China), C1100(Japan), C11000(USA), E-CU58(Germany), CU-ETP(EU, ISO). Copper purity more than 99.95%. This is RA copper foil, one side is polished side and the other side is matte. We also have ED copper foil, ED copper foil can choose one side polished and double side polished. The ED copper can have a higher purity. welcome to contact us if you need it.
Width, length, thickness all can be customized. we can also provide DIE cutting service.
We are also copper foil processing factory, Backing adhesive glue on the copper foil, laminate the copper foil with polymer films like PET, PI, PE and other films. DIE cut into customized shapes. you can send us your drawings and we can cut it into your shapes.
Chemical Content, %
|
Cu |
Bi |
Sb |
As |
Fe |
Ni |
Pb |
S |
Zn |
ROHS Directive |
|||
|
Cd |
Pb |
Hg |
Cr |
|||||||||
|
99.90 |
0.001 |
0.002 |
0.002 |
0.005 |
- |
0.005 |
0.005 |
- |
ND |
ND |
ND |
ND |
Physical Properties
| Item | DB44/837-2010 standard | Q/HZY001-2012 standard | |||||||||
| Double side polished | Single side polished | Double side polished | Single side polished | ||||||||
| Standard Thick | um | 8 | 9 | 12 | 9 | 7 | 8 | 9 | 12 | 8 | 9 |
| Basic weight | g/m2 | 70-75 | 85-90 | 100-105 | 85-90 | 62-65 | 70-75 | 85-90 | 100-105 | 70-75 | 85-95 |
| Test thickness | um | / | / | / | / | ≤8 | ≤9 | ≤10 | ≤13 | ≤10 | ≤11 |
| Cu | % | ≥99.8 | ≥99.8 | ≥99.8 | ≥99.8 | ≥99.8 | ≥99.8 | ≥99.8 | ≥99.8 | ≥99.8 | ≥99.8 |
| TS | Room | ≥294 | ≥294 | ≥294 | ≥245 | ≥294 | ≥294 | ≥294 | ≥294 | ≥245 | ≥245 |
| 180℃ | ≥196 | ≥196 | ≥196 | ≥147 | ≥196 | ≥196 | ≥196 | ≥196 | ≥147 | ≥147 | |
| Ductility | Room | ≥5 | ≥5 | ≥5 | ≥2.5 | ≥5 | ≥5 | ≥5 | ≥5 | ≥2.5 | ≥2.5 |
| 180℃ | ≥3 | ≥3 | ≥3 | ≥2 | ≥3 | ≥3 | ≥3 | ≥3 | ≥2 | ≥2 | |
|
surface roughness
|
Polished side | ≤3 | ≤3 | ≤3 | ≤3 | ≤3 | ≤3 | ≤3 | ≤3 | ≤3 | ≤3 |
| Coarse side | ≤0.3 | ≤0.3 | ≤0.3 | ≤0.5 | ≤0.3 | ≤0.3 | ≤0.3 | ≤0.3 | ≤0.5 | ≤0.5 | |
| wettability | mN/m | ≥32 | ≥32 | ≥32 | ≥32 | ≥32 | ≥32 | ≥32 | ≥32 | ≥32 | ≥32 |
| high temperature oxidation resistance | 160℃/10 min copper foil surface should be no oxidation discoloration | 180℃/10 min copper foil surface should be no oxidation discoloration | |||||||||
Application of Copper foil
1) Electric and electricsprings,switches
2) Lead frames
3) Connectors and oscillation reeds
3) PCB field
4) Communication cable, Cable armoring, Mobile phone mainboard
5) Ion battery production lamination with PI film
6) PCB collector(electrode backing) materials
High Purity Soft 10um Conductive Copper Foil Rolls
10 Micron Pure Electrolytic Thin Copper Foil
C11000 Insulation Transformer PCB Copper Foil
| Sitemap
