Electrolytic PCB Copper Foil
Specification:
1. CCL/PCB copper foil are classfied as: STD,HTE,VLP,FCF,and RTF.
2. Now,we talk about HTE copper foil.
3. For S-HTE copper foil, we can do ordinary thickness ,such as, 12μm, 18μm, 25μm, 35μm, etc.
4. The Maximum width is 1295mm.
5. The usage of S-HTE copper foil : widely usesd in shielding signals , and also in the electronic wires and cables.
Technical Data:
|
Classification |
Unit |
1/4OZ (9μm) |
1/3OZ (12μm) |
J OZ (15μm) |
1/2OZ (18μm) |
1OZ (35μm) |
2OZ (70μm) |
|
|
Cu Content |
% |
≥99.8 |
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|
Area Weigth |
g/m2 |
80±3 |
107±3 |
127±4 |
153±5 |
283±5 |
585±10 |
|
|
Tensile Strength |
R.T.(25℃) |
Kg/mm2 |
≥28 |
≥30 |
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|
H.T.(180℃) |
≥15 |
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|
Elongation |
R.T.(25℃) |
% |
≥4.0 |
≥5.0 |
≥6.0 |
≥10 |
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|
H.T.(180℃) |
≥4.0 |
≥5.0 |
≥6.0 |
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|
Roughness |
Shiny(Ra) |
μm |
≤0.4 |
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|
Matte(Rz) |
≤5.0 |
≤6.0 |
≤7.0 |
≤7.0 |
≤9.0 |
≤14 |
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|
Peel Strength |
R.T.(23℃) |
Kg/cm |
≥1.0 |
≥1.2 |
≥1.2 |
≥1.3 |
≥1.8 |
≥2.0 |
|
Degraded rate of HCΦ(18%-1hr/25℃) |
% |
≤5.0 |
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|
Change of color(E-1.0hr/190℃) |
% |
Good |
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|
Solder Floating 290℃ |
Sec. |
≥20 |
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|
Pinhole |
EA |
Zero |
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|
Preperg |
---- |
FR-4 |
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Characteristics:
1. Fine and uniform crystal structure;
2. Low profile, high intensity;
3. High elongation and smooth surface.
Metallographic:
Product Photo
Our Service:
1. The quality of copper foil is a very important factor for PCB's quality.we can provide you A4 size sample for testing,
2. In addition,in order to make our business more fair,we have opened the "Trade Assurance Service" on Alibaba, a certain amount ensures the online business. which safeguard the business goes smoothly.
3. Our copper foil is provided directly from factory,meanwhile,the copper foil price is also the original price.
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