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0.006mm Shielding CCL / PCB 3oz Electrolytic Copper Foil
0.006mm Electrolytic Copper Foil
,3oz Electrolytic Copper Foil
,2oz Electrolytic Copper Foil
0.006mm Shielding CCL / PCB Electrolytic Copper Foil
Description:
Electrolytic copper foil is an important material for the manufacture of copper clad laminates (CCL) and printed circuit boards (PCBs) and lithium ion batteries. In the rapid development of today's electronic information industry, electrolytic copper foil is called the "neural network" of electronic product signal and power transmission and communication. Since 2002, the production value of China's printed circuit boards has entered the third place in the world. As the substrate material for PCBs, CCL has also become the third largest producer in the world.
Electrolytic copper foil production process is simple, the main process has three: solution foil, surface treatment and product slitting. Its production process seems simple, but it is a combination of electronics, machinery and electrochemistry, and it is a production process that requires particularly strict production environment.
Features:
1. the treated foil in gray or red
2. High peel strength
3. Good etch ability
4. Excellent adhesion to etching resist
Application:
1. Phenolic resin board
2. Epoxy board
Typical properties of Standard copper foil
|
Classification
|
Unit | Requirement | Test Method | |||||||||||
| Foil Designation | / | T | H | M | 1 | 2 | 3 | IPC-4562A | ||||||
| Nominal thickness | / | 12um | 1/2 OZ | 3/4 OZ |
1 OZ |
2 OZ |
3 OZ |
IPC-4562A | ||||||
| Area Weight |
g/m2
|
107±4 | 153±5 | 228±8 | 285±10 | 580±15 | 860±20 |
IPC-TM-650 2.2.12.2 |
||||||
| Purity | % | ≥99.8 |
IPC-TM-650 2.3.15 |
|||||||||||
| Foil Profile | Shiny side (Ra) | um | ≤0.4 | ≤0.4 | ≤0.4 | ≤0.4 | ≤0.4 | ≤0.4 |
IPC-TM-650 2.3.17 |
|||||
| Matte side(Rz) | um | ≤6 | ≤8 | ≤10 | ≤10 | ≤15 | ≤20 | |||||||
| Tensile Strength |
R.T.(23℃)
|
Mpa | ≥150 | ≥220 | ≥235 | ≥280 | ≥280 | ≥280 |
IPC-TM-650 2.3.18 |
|||||
| Elongation |
R.T.(23℃)
|
% | ≥2 | ≥3 | ≥3 | ≥4 | ≥4 | ≥4 |
IPC-TM-650 2.3.18 |
|||||
| Subject | Ω.g/m2 | ≤0.170 | ≤0.166 | ≤0.162 | ≤0.162 | ≤0.162 | ≤0.162 |
IPC-TM-650 2.5.14 |
||||||
| Peel Strength(FR-4) | N/mm | ≥1.0 | ≥1.3 | ≥1.6 | ≥1.6 | ≥2.1 | ≥2.1 |
IPC-TM-650 2.4.8 |
||||||
| Pinholes&porosity | Number | No |
IPC-TM-650 2.1.2 |
|||||||||||
| Anti-oxidization | R.T.(23℃) | day | 180 | / | ||||||||||
| H.T.(200℃) | Minutes | 60 | / | |||||||||||
1. Standard Width,1295(±1)mm,May according to the customer request tailor.
2. We test the peel strength with FR-4(Tg140) prepreg ,please reconfirm with your pp.
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C1100 C1020 C1220 Transformer Strip Thin Copper Foil Product Details 1. Grade:C1100,C1020,C1220 2. Thickness:0.005-1.2mm 3. Width:400mm max 4. Chemincal composition: C1100:Cu≥99.9%;C1020:Cu≥99.96%;C1220:Cu≥99.97% P:0.015-0.04% 5. Oxgen content:C1100:O80% Applications 1. Electric and electric springs switches 2. Lead frames 3. Connectors and oscillation reeds 4. PCB field 5. Communication cable 6. Cable armoring 7. Mobile phone main board 8. Ion battery production lamination
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High Peel Strength Width 520mm C11000 Insulated Copper Foil
High Peel Strength Width 520mm C11000 Insulated Copper Foil Quickly details Thickness: 0.012-0.070 mm Width: 5-520 mm Length: 500-5000 M ID: 76 mm,152 mm Alloy: T2,C11000,C1100,C101,E-Cu58 Temper: H Features: 1. the treated foil in gray or red 2. High peel strength 3. Good etch ability 4. Excellent adhesion to etching resist Application: 1. Phenolic resin board 2. Epoxy board Compare between CA copper foil and ED copper foil 1. Process: rolled copper foil (Rolling process),ED
