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CCL Thickness 9 Micron Red PCB Copper Foil

CCL Thickness 9 Micron Red PCB Copper Foil

    • CCL Thickness 9 Micron Red PCB Copper Foil
    • CCL Thickness 9 Micron Red PCB Copper Foil
  • CCL Thickness 9 Micron Red PCB Copper Foil

    Product Details:

    Place of Origin: China
    Brand Name: OEM
    Certification: ISO / SGS / RoHS

    Payment & Shipping Terms:

    Minimum Order Quantity: 50kg
    Price: Negotiable
    Packaging Details: Exporting Wooden Case
    Delivery Time: 10 - 15 Days
    Payment Terms: L/C, T/T
    Supply Ability: 550T Per Month
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    Detailed Product Description
    Alloy Number: C11000 Material: Red Copper
    Shape: Roll Size Thickness: 1/4OZ~20OZ(9μm~70μm)
    Width: 550mm~1295mm Density: 8.9g/cm3
    Application: CCL,PCB HS Code: 7410110000
    Grade: Pure Copper Alloy Or Not: Non-alloy
    High Light:

    18 micron PCB Copper Foil

    ,

    9 Micron Red PCB Copper Foil

    ,

    35 micron PCB Copper Foil

    CCL Thickness 9 Micron Red PCB Copper Foil

     

     

    Description:


    CCL/PCB electrolytic copper foil are classified as :Standard electrolytic copper foil(STD),High-temperture elongation of the copper foil( HTE) ,ultra-low contour copper foil(VLP), flexible copper foil(FCF),inversion of opper foil(RTF).Ordinary thickness of the ED copper foils are 9 microns and 12 microns ,18 microns,35 microns etc. The maximum width of the ED copper foil iw 1370mm(53.93inch),.Also we can do special process according to customer requirements .

     

    Feature

     

    . High temperature anti-oxidization performance.

    . High temperature elongation performance.

    . Environment friendly production.

     

    Specification:

     

    Classification

    Unit

    1/4OZ

    (9μm)

    1/3OZ

    (12μm)

    J OZ

    (15μm)

    1/2OZ

    (18μm)

    1OZ

    (35μm)

    2OZ

    (70μm)

    Cu Content

    %

    ≥99.8

    Area Weigth

    g/m2

    80±3

    107±3

    127±4

    153±5

    283±5

    585±10

    Tensile Strength

    R.T.(25℃)

    Kg/mm2

    ≥28

    ≥30

    H.T.(180℃)

    ≥15

    Elongation

    R.T.(25℃)

    %

    ≥4.0

    ≥5.0

    ≥6.0

    ≥10

    H.T.(180℃)

    ≥4.0

    ≥5.0

    ≥6.0

    Roughness

    Shiny(Ra)

    μm

    ≤0.4

    Matte(Rz)

    ≤5.0

    ≤6.0

    ≤7.0

    ≤7.0

    ≤9.0

    ≤14

    Peel Strength

    R.T.(23℃)

    Kg/cm

    ≥1.0

    ≥1.2

    ≥1.2

    ≥1.3

    ≥1.8

    ≥2.0

    Degraded rate of HCΦ(18%-1hr/25℃)

    %

    ≤5.0

    Change of color(E-1.0hr/190℃)

    %

    Good

    Solder Floating 290℃

    Sec.

    ≥20

    Pinhole

    EA

    Zero

    Preperg

    ----

    FR-4

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

    CCL Thickness 9 Micron Red PCB Copper Foil 0

     

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