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Home ProductsTin Plated Copper Foil

C10300 Tin Plated Copper Foil

C10300 Tin Plated Copper Foil

    • C10300 Tin Plated Copper Foil
    • C10300 Tin Plated Copper Foil
  • C10300 Tin Plated Copper Foil

    Product Details:

    Place of Origin: China
    Brand Name: OEM
    Certification: ISO / SGS / RoHS

    Payment & Shipping Terms:

    Minimum Order Quantity: 50kg
    Price: Negotiable
    Packaging Details: Exporting Wooden Case
    Delivery Time: 10 - 15 Days
    Payment Terms: L/C, T/T
    Supply Ability: 550T Per Month
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    Detailed Product Description
    Application: Connector, Lead Frame Power Transistor, Electric Industrial Components Thickness: 0.035mm- 2.5mm
    Width: 7--610mm Material: C10300 Oxygen Free Copper
    Grade: C10300 Cu (Min): 99.95%
    Alloy Or Not: Non-alloy Name: Nickel Plated Copper Foil Se-Cu57 C10300
    Shape: Customised Sample: Avialable
    Type: Flat Length: Customer's Demands
    Electric 20 CConductivity: >100%IACS State: Custom
    Package: Fumigation Wooden Package Standard: JIS ASTM DIN EN ISO
    Port: SHANGHAI
    Highlight:

    0.035mm Tin Plated Copper Foil

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    C10300 Tin Plated Copper Foil

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    610mm Tin Plated Copper Foil

    C10300 Tin Plated Copper Foil

     

     

    Applications
     
    submarine fibre optic cable, Longitudinally welded cables, Radio Frequency(RF)Cables, Copper tape screen for XLPE cable, Components for the electrical industry, Heat Sinks

     

    Description Of Copper & Tin plating

     

    • Copper (Cu) is used to coat zinc, aluminium, and magnesium, as first coating before further plating. It is used to improve the solderability of the named materials, decrease their electrical resistance, harden them against abrasive and adhesive wear.
    • Copper plating is a phase in chromium plating of plastics. It is also used for decoration.
    • Tin (Sn) is used to plate steel components already coated by nickel or copper, against corrosion; steel plates for the conservation industry; for improving the solderability of surfaces in the electronic industry. Basic and acid electrolytes are used.

     

    High Conductivity Copper C10300
    Standard
    DIN EN ASTM JIS
    Material code No. Material code No. UNS No. JIS No.
    SE-Cu 58 2.007 Cu-PHC CW020A 10300 C1030
    Cu     P
    ≥99.95     ≈0.003
    Electrical conductivity IACS%(20℃) 100 Thermal conductivity W/(m*K) 390
    Modulus of elasticity (KN/mm2) 127
    Merit                  
    With high purity,excellent thermal and electrical conductivity, great machinability, solder ability and corrosion resistance
    Mechanical Properties                  
    Temper Class Temper Tensile Strength Yield Strength Elongation A50 Vickers Hardness Bending Test
              90 degree (R/T)
    (Rm,Mpa) (Rp0.2,Mpa) (%) (HV) GW BW
    R220 O 220-260 140max 33min 40-65 0 0
    R240 1/4H 240-300 180min 8min 65-95 0 0
    R290 H 290-360 250min 4min 90-110 0 0
    R360 EH 360min 320min 2min 110min 0 0.5
     
    Inventory: Thickness: 0.1-3.0mm  Hardness Temper: Soft, 1/4H & H
     

     

    C10300 Tin Plated Copper Foil 0

    C10300 Tin Plated Copper Foil 1

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