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Anti Oxidizing Width 600mm Single Side Tin Plated Copper Foil
Single Side Tin Plated Copper Foil
,600mm Tin Plated Copper Foil
,0.15mm Tin Plated Copper Foil
Anti Oxidizing Width 600mm Single Side Tin Plated Copper Foil
1. Description
Copper product is easy to oxidation when expose in the air and form verdigris. Verdigris can cause large resistance, poor conductivity and power transmission loss. Tin plated copper product due to tin itself characteristics can form stannic oxide thin films to prevent further oxidation. Tin can also form a similar film in halogens so that the tin plated copper product has well corrosion resistance and weldability. At the same time, tin plated copper product has a certain degree of strength and hardness. So it is widely used in electrical and electronic industry product.
Due to the non-toxic and tasteless of tin, tin product is widely used in the food industry, too.
2. Base Material:
High-precision Rolled Copper Foil, Cu(JIS: C1100/ASTM: C11000) content more than 99.96%
3. Base Material Thickness Range:
0.012mm~0.15mm (0.00047inches~0.0059inches)
4. Base Material Width Range:
≤600mm (≤23.62inches)
5. Specification
| Items | Weldable Tin Plating | Non-weldable Tin Plating |
| Width Range | ≤600mm (≤23.62inches) | |
| Thickness Range | 0.012~0.15mm (0.00047inches~0.0059inches) | |
| Tin layer Thickness | ≥0.3µm | ≥0.2µm |
| Tin Content of Tin Layer | 65~92%(Can adjust tin content according to customer welding process) | 100% Pure Tin |
| Surface Resistance of Tin Layer (Ω) | 0.3~0.5 | 0.1~0.15 |
| Adhesion | 5B | |
| Tensile Strength | Base Material Performance Attenuation after Plating ≤10% | |
| Elongation | Base Material Performance Attenuation after Plating ≤6% | |
Single Side Red Thickness 12um Copper Foil Rolls
Single Side Red Thickness 12um Copper Foil Rolls Quickly details . Low profile and Single side side treatment in red. . Thickness: 12um . Width: ≤520 mm . Length: ≤5000 M . ID: 76 mm,152 mm . Alloy: C11000 Features: 1. Red color 2. Good performance in resistant to bending suitable for FCCL. 3. High density performance leads to high flexibility Application: Suitable for FCCL, FPC, COVERLAY, BONDING FILM TDS for FPC FCCL with all thickness. Thickness 0.10/0.012/0.018/0.025/0
C1100 C1020 C1220 Transformer Strip Thin Copper Foil
C1100 C1020 C1220 Transformer Strip Thin Copper Foil Product Details 1. Grade:C1100,C1020,C1220 2. Thickness:0.005-1.2mm 3. Width:400mm max 4. Chemincal composition: C1100:Cu≥99.9%;C1020:Cu≥99.96%;C1220:Cu≥99.97% P:0.015-0.04% 5. Oxgen content:C1100:O80% Applications 1. Electric and electric springs switches 2. Lead frames 3. Connectors and oscillation reeds 4. PCB field 5. Communication cable 6. Cable armoring 7. Mobile phone main board 8. Ion battery production lamination
99.9% Purity Red Rolled Electrodeposited Copper Foil
99.9% Purity Red Rolled Electrodeposited Copper Foil Description: Electrolytic copper foil is a foil-based form of copper with a thickness generally less than 80micron. A rolled foil is made by annealing and rolling the electrolytic copper uninterruptedly.The production process involves electrodepositing copper to a rolling drum and then again rolling it up. For the process of electrodeposition, high-grade copper is dissolved in acid to form a copper electrolyte. This copper
High Peel Strength Width 520mm C11000 Insulated Copper Foil
High Peel Strength Width 520mm C11000 Insulated Copper Foil Quickly details Thickness: 0.012-0.070 mm Width: 5-520 mm Length: 500-5000 M ID: 76 mm,152 mm Alloy: T2,C11000,C1100,C101,E-Cu58 Temper: H Features: 1. the treated foil in gray or red 2. High peel strength 3. Good etch ability 4. Excellent adhesion to etching resist Application: 1. Phenolic resin board 2. Epoxy board Compare between CA copper foil and ED copper foil 1. Process: rolled copper foil (Rolling process),ED
