Quality FPC FCCL FPCB 25μm 70μm Thin RA Copper Foil factory
Quality FPC FCCL FPCB 25μm 70μm Thin RA Copper Foil factory
Quality FPC FCCL FPCB 25μm 70μm Thin RA Copper Foil factory

FPC FCCL FPCB 25μm 70μm Thin RA Copper Foil

Place of Origin: China
Brand Name: OEM
Certification: ISO / SGS / RoHS
Minimum Order Quantity: 50kg
Price: Negotiable
Copper Content: Min99.99 Peel Strength: 1.35N/MM
Thickness: 0.035mm Material: Cu
Density: 8.9g/cm³ Application: Lithium Battery Special Use Copper Foil
Material: Red Copper Alloy Or Not: Non-alloy
Shape: Coil Color: Red Coppery
Highlight

25um RA Copper Foil

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FCCL RA Copper Foil

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70um RA Copper Foil

Product Description

FPC FCCL FPCB 25μm 70μm Thin RA Copper Foil

 

 

Dimension Range:

Copper Foil thickness from 12~100µm can be supplied for FPC.

Width can be made according to clients’ requirement up to 650mm.

 

Applications:

Flexible Copper Clad Laminate(FCCL), Fine Circuit FPC, LED coated crystal thin film, FPCB.

 

Features:

The material has higher extensibility, and has a high bending resistance and no crack.

 

Table 1:FPC T2 high flex rolled copper foil properties (GB/T5230-2000,IPC-4562-2000)

 

Item Unit Parameters
12μm 18μm 25μm 35μm 70μm
Mass per unit(±5%) g/m² 107 160 300 400 445
Cu+Ag % ≥99.99
Temper   H O,H O,H O,H O,H
Surface roughness Rz μm 0.4 0.5 0.7 0.74 0.76
Tensile strength Normal Temp /23℃ N/mm² ≥430 ≥450 ≥450 ≥460 ≥460
High Temp /220℃ N/mm² ≥140 ≥150 ≥170 ≥210 ≥220
Elongation Normal Temp /23℃ % ≥1.5 ≥3.0 ≥4.0 ≥4.2 ≥4.5
High Temp /220℃ % ≥8 ≥10 ≥18 ≥28 ≥30
Fatigue Resistance (annealed) % 65 65 65 65 65
Hardness HV ≤50
Maximum resistivity Ωmm2/m 0.0171
Electrical conductivity % ≥98.3%
Pinhole test results piece/㎡ Pinhole area more than 0.5 mm²,0.005 piece/㎡
 

Note: 1. Above figures based on the material temper H.

2. Copper Foil has smooth and shiny surface,without any coating..

3. Testing method follows our company standard.

 

FPC FCCL FPCB 25μm 70μm Thin RA Copper Foil 0

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