C1100 Nickel Plated Copper Foil
Product Specification
C1100 Nickel Plated Copper Foil Product Description Copper: T2(C1100) Alloy elements Cu+Ag Bi Sb As Fe Pb S … Copper/T2 99.98 0.001 0.002 0.002 0.001 0.005 0.005 High purity, low oxygen content, excellent electrical conductivity, suitable for fine beating, good thermal and electric path, processing, ...
Pure Nickel Plated Copper Foil
,C1100 Nickel Plated Copper Foil
,corrosion resistance Nickel Plated Copper Foil
Product Description
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Alloy elements
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Cu+Ag
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Bi
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Sb
|
As
|
Fe
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Pb
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S
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…
|
|
Copper/T2
|
99.98
|
0.001
|
0.002
|
0.002
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0.001
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0.005
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0.005
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|
|
The resistivity(Ωm㎡/m)
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≦0.024
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|
Elongation(%)
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15~30
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|
Tensile strength(MPa)
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150-170
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|
Peel strength(N/mm)
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>12
|
|
Surface hardness(HV 0.3)
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76/37
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Advantages
2. anti-electromagnetic interference
3. cheap price
4. with high chemical volatility, in sulfuric acid, nitric acid, hydrochloric acid dilute solution simply insoluble.

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