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99.9% Purity Red Rolled Electrodeposited Copper Foil

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Product Attributes
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99.9% Electrodeposited Copper Foil

,

18um Electrodeposited Copper Foil

,

35um Electrodeposited Copper Foil

Application:
Terminals
Width:
7--610mm
Material:
Red Copper
Grade:
Pure Copper
Cu (Min):
99.90%
Alloy Or Not:
Non-alloy
Processing Service:
Bending, Welding, Decoiling, Cutting, Punching, Coating
Name:
High Purity 99.9% Electrolytic Copper Foil
Shape:
Customised
Color:
Red
Type:
Flat
Length:
Customer's Demands
Electric 20 CConductivity:
C1100 >97%
State:
Custom
Package:
Fumigation Wooden Package

Product Description

Detailed Specifications & Features

99.9% Purity Red Rolled Electrodeposited Copper Foil

 

 

Description:

 

  Electrolytic copper foil is a foil-based form of copper with a thickness generally less than 80micron. A rolled foil is made by annealing and rolling the electrolytic copper uninterruptedly.The production process involves electrodepositing copper to a rolling drum and then again rolling it up. For  the process of electrodeposition, high-grade copper is dissolved in acid to form a copper electrolyte. This copper electrolyte solution is then pumped into electrically charged rotating drums. On drums, a thin film of copper is then electrodeposited. This process  is also called as electrolytic plating. Electrolytic copper foils provide exceptional tensile strength as well as increased  elongation  characteristics.  These foils are most commonly used as a superconductor in printed circuit boards as well as flexible connectors. Since, copper possesses high electrical conductivity, and is extraordinarily ductile and malleable,makes it one of the most extensively used metals in the everemerging electrical and electronics industry.

 

Feature:

 

1, symmetrical structure of both sides,99.9% copper density,very low profile.
2, high elongation and tensile strength
3, very environmental,can be recycled

 

 

Technical Data:

 

Classification Unit 9μm 12μm 18μm 35μm
Cu Content % ≥99.8
Area Weigth g/m2 80±3 107±3 153±5 283±7
Tensile Strength R.T.(23℃) Kg/mm2 ≥28
H.T.(180℃) ≥15 ≥15 ≥15 ≥18
Elongation R.T.(23℃) % ≥5.0 ≥5.0 ≥6.0 ≥10
H.T.(180℃) ≥6.0 ≥6.0 ≥8.0 ≥8.0
Roughness Shiny(Ra) μm ≤0.43
Matte(Rz) ≤2.5
Peel Strength R.T.(23℃) Kg/cm ≥0.77 ≥0.8 ≥0.8 ≥0.8
Degraded rate of HCΦ(18%-1hr/25℃) % ≤7.0
Change of color(E-1.0hr/200℃) % Good
Solder Floating 290℃ Sec. ≥20
Appearance(Spot and copper powder) ---- None
Pinhole EA Zero
Size Tolerance Width mm 0~2mm
Length mm ----
Core Mm/inch

Inside Diameter 79mm/3 inch

 

99.9% Purity Red Rolled Electrodeposited Copper Foil

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