9um 12um 18um 35um High Density FPC PCB Copper Foil

Place of Origin:China
Brand Name:OEM
Certification:ISO / SGS / RoHS
Minimum Order Quantity:50kg
Price:Negotiable
Payment Terms:L/C, T/T
Supply Ability:550T Per Month
Product Details
Highlight:

35um PCB Copper Foil

,

18um PCB Copper Foil

,

9um PCB Copper Foil

Product Name: Single Shiny ED Red Copper Foil For FPC , Maximum Width 600mm
Alloy Number: C11000
Material: Red Copper
Shape: Roll
Density: 8.9g/cm3
Thickness: 1/4OZ~1OZ(9μm~35μm)
Width: 250mm~1295mm
Application: FPC
HS Code: 7410110000
Degraded Rate Of HCΦ(18%-1hr/25℃): ≤7.0%
Product Description

9um 12um 18um 35um High Density FPC PCB Copper Foil

 

Specification:


Thickness: 9µm~35µm

 

Performances:

 

The product surface is black or red, has lower surface roughness.

 

Applications:

 

Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED coated crystal thin film.

 

Features:


High density, high bending resistance and good etching performance.

 

Microstructure:

 

9um 12um 18um 35um High Density FPC PCB Copper Foil 0

 

Table1- Performance:

 

Classification

Unit

9μm

12μm

18μm

35μm

Cu Content

%

≥99.8

Area Weigth

g/m2

80±3

107±3

153±5

283±7

Tensile Strength

R.T.(23℃)

Kg/mm2

≥28

H.T.(180℃)

≥15

≥15

≥15

≥18

Elongation

R.T.(23℃)

%

≥5.0

≥5.0

≥6.0

≥10

H.T.(180℃)

≥6.0

≥6.0

≥8.0

≥8.0

Roughness

Shiny(Ra)

μm

≤0.43

Matte(Rz)

≤2.5

Peel Strength

R.T.(23℃)

Kg/cm

≥0.77

≥0.8

≥0.8

≥0.8

Degraded rate of HCΦ(18%-1hr/25℃)

%

≤7.0

Change of color(E-1.0hr/200℃)

%

Good

Solder Floating 290℃

Sec.

≥20

Appearance(Spot and copper powder)

----

None

Pinhole

EA

Zero

Size Tolerance

Width

mm

0~2mm

Length

mm

----

Core

Mm/inch

Inside Diameter 79mm/3 inch

 

9um 12um 18um 35um High Density FPC PCB Copper Foil 1

 

 

Why Choose us Civen as your supplier?

 

1. Very competitive price
2. Small order acceptable
3. Good quality
4. On time delivery and perfect service
5. Customers' design are welcome!

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