9um 12um 18um 35um High Density FPC PCB Copper Foil
35um PCB Copper Foil
,18um PCB Copper Foil
,9um PCB Copper Foil
9um 12um 18um 35um High Density FPC PCB Copper Foil
Specification:
Thickness: 9µm～35µm
Performances:
The product surface is black or red, has lower surface roughness.
Applications:
Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED coated crystal thin film.
Features:
High density, high bending resistance and good etching performance.
Microstructure:
Table1- Performance:
|
Classification |
Unit |
9μm |
12μm |
18μm |
35μm |
|
|
Cu Content |
% |
≥99.8 |
||||
|
Area Weigth |
g/m2 |
80±3 |
107±3 |
153±5 |
283±7 |
|
|
Tensile Strength |
R.T.(23℃) |
Kg/mm2 |
≥28 |
|||
|
H.T.(180℃) |
≥15 |
≥15 |
≥15 |
≥18 |
||
|
Elongation |
R.T.(23℃) |
% |
≥5.0 |
≥5.0 |
≥6.0 |
≥10 |
|
H.T.(180℃) |
≥6.0 |
≥6.0 |
≥8.0 |
≥8.0 |
||
|
Roughness |
Shiny(Ra) |
μm |
≤0.43 |
|||
|
Matte(Rz) |
≤2.5 |
|||||
|
Peel Strength |
R.T.(23℃) |
Kg/cm |
≥0.77 |
≥0.8 |
≥0.8 |
≥0.8 |
|
Degraded rate of HCΦ(18%-1hr/25℃) |
% |
≤7.0 |
||||
|
Change of color(E-1.0hr/200℃) |
% |
Good |
||||
|
Solder Floating 290℃ |
Sec. |
≥20 |
||||
|
Appearance(Spot and copper powder) |
---- |
None |
||||
|
Pinhole |
EA |
Zero |
||||
|
Size Tolerance |
Width |
mm |
0~2mm |
|||
|
Length |
mm |
---- |
||||
|
Core |
Mm/inch |
Inside Diameter 79mm/3 inch |
||||
Why Choose us Civen as your supplier?
1. Very competitive price
2. Small order acceptable
3. Good quality
4. On time delivery and perfect service
5. Customers' design are welcome!
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