Quality 9um 12um 18um 35um High Density FPC PCB Copper Foil factory

9um 12um 18um 35um High Density FPC PCB Copper Foil

Place of Origin: China

Brand Name: OEM

Certification: ISO / SGS / RoHS

Minimum Order Quantity: 50kg

Price: Negotiable

Tags:

FPC PCB Copper Foil

Product Name:	Single Shiny ED Red Copper Foil For FPC , Maximum Width 600mm	Alloy Number:	C11000
Material:	Red Copper	Shape:	Roll
Density:	8.9g/cm3	Thickness:	1/4OZ~1OZ(9μm~35μm)
Width:	250mm~1295mm	Application:	FPC
HS Code:	7410110000	Degraded Rate Of HCΦ(18%-1hr/25℃):	≤7.0%
Highlight	35um PCB Copper Foil , 18um PCB Copper Foil , 9um PCB Copper Foil

Product Description

9um 12um 18um 35um High Density FPC PCB Copper Foil

Specification:

Thickness: 9µm～35µm

Performances:

The product surface is black or red, has lower surface roughness.

Applications:

Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED coated crystal thin film.

Features:

High density, high bending resistance and good etching performance.

Microstructure:

9um 12um 18um 35um High Density FPC PCB Copper Foil 0

Table1- Performance:

Classification		Unit	9μm	12μm	18μm	35μm
Cu Content		%	≥99.8
Area Weigth		g/m2	80±3	107±3	153±5	283±7
Tensile Strength	R.T.(23℃)	Kg/mm2	≥28
	H.T.(180℃)		≥15	≥15	≥15	≥18
Elongation	R.T.(23℃)	%	≥5.0	≥5.0	≥6.0	≥10
	H.T.(180℃)		≥6.0	≥6.0	≥8.0	≥8.0
Roughness	Shiny(Ra)	μm	≤0.43
	Matte(Rz)		≤2.5
Peel Strength	R.T.(23℃)	Kg/cm	≥0.77	≥0.8	≥0.8	≥0.8
Degraded rate of HCΦ(18%-1hr/25℃)		%	≤7.0
Change of color(E-1.0hr/200℃)		%	Good
Solder Floating 290℃		Sec.	≥20
Appearance(Spot and copper powder)		----	None
Pinhole		EA	Zero
Size Tolerance	Width	mm	0~2mm
	Length	mm	----
Core		Mm/inch	Inside Diameter 79mm/3 inch

9um 12um 18um 35um High Density FPC PCB Copper Foil 1

Why Choose us Civen as your supplier?

1. Very competitive price
2. Small order acceptable
3. Good quality
4. On time delivery and perfect service
5. Customers' design are welcome!

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