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Home ProductsPCB Copper Foil

9um 12um 18um 35um High Density FPC PCB Copper Foil

9um 12um 18um 35um High Density FPC PCB Copper Foil

    • 9um 12um 18um 35um High Density FPC PCB Copper Foil
    • 9um 12um 18um 35um High Density FPC PCB Copper Foil
  • 9um 12um 18um 35um High Density FPC PCB Copper Foil

    Product Details:

    Place of Origin: China
    Brand Name: OEM
    Certification: ISO / SGS / RoHS

    Payment & Shipping Terms:

    Minimum Order Quantity: 50kg
    Price: Negotiable
    Packaging Details: Exporting Wooden Case
    Delivery Time: 10 - 15 Days
    Payment Terms: L/C, T/T
    Supply Ability: 550T Per Month
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    Detailed Product Description
    Product Name: Single Shiny ED Red Copper Foil For FPC , Maximum Width 600mm Alloy Number: C11000
    Material: Red Copper Shape: Roll
    Density: 8.9g/cm3 Thickness: 1/4OZ~1OZ(9μm~35μm)
    Width: 250mm~1295mm Application: FPC
    HS Code: 7410110000 Degraded Rate Of HCΦ(18%-1hr/25℃): ≤7.0%
    High Light:

    35um PCB Copper Foil

    ,

    18um PCB Copper Foil

    ,

    9um PCB Copper Foil

    9um 12um 18um 35um High Density FPC PCB Copper Foil

     

    Specification:


    Thickness: 9µm~35µm

     

    Performances:

     

    The product surface is black or red, has lower surface roughness.

     

    Applications:

     

    Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED coated crystal thin film.

     

    Features:


    High density, high bending resistance and good etching performance.

     

    Microstructure:

     

    9um 12um 18um 35um High Density FPC PCB Copper Foil 0

     

    Table1- Performance:

     

    Classification

    Unit

    9μm

    12μm

    18μm

    35μm

    Cu Content

    %

    ≥99.8

    Area Weigth

    g/m2

    80±3

    107±3

    153±5

    283±7

    Tensile Strength

    R.T.(23℃)

    Kg/mm2

    ≥28

    H.T.(180℃)

    ≥15

    ≥15

    ≥15

    ≥18

    Elongation

    R.T.(23℃)

    %

    ≥5.0

    ≥5.0

    ≥6.0

    ≥10

    H.T.(180℃)

    ≥6.0

    ≥6.0

    ≥8.0

    ≥8.0

    Roughness

    Shiny(Ra)

    μm

    ≤0.43

    Matte(Rz)

    ≤2.5

    Peel Strength

    R.T.(23℃)

    Kg/cm

    ≥0.77

    ≥0.8

    ≥0.8

    ≥0.8

    Degraded rate of HCΦ(18%-1hr/25℃)

    %

    ≤7.0

    Change of color(E-1.0hr/200℃)

    %

    Good

    Solder Floating 290℃

    Sec.

    ≥20

    Appearance(Spot and copper powder)

    ----

    None

    Pinhole

    EA

    Zero

    Size Tolerance

    Width

    mm

    0~2mm

    Length

    mm

    ----

    Core

    Mm/inch

    Inside Diameter 79mm/3 inch

     

    9um 12um 18um 35um High Density FPC PCB Copper Foil 1

     

     

    Why Choose us Civen as your supplier?

     

    1. Very competitive price
    2. Small order acceptable
    3. Good quality
    4. On time delivery and perfect service
    5. Customers' design are welcome!

    Contact Details
    Beijing Silk Road Enterprise Management Services Co.,LTD
    Send your inquiry directly to us (0 / 3000)

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