Beijing Silk Road Enterprise Management Services Co.,LTD
Beijing Silk Road Enterprise Management Services Co.,LTD
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| Place of Origin: | China |
| Brand Name: | OEM |
| Certification: | ISO / SGS / RoHS |
| Minimum Order Quantity: | 50kg |
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| Price: | Negotiable |
| Packaging Details: | Exporting Wooden Case |
| Delivery Time: | 10 - 15 Days |
| Payment Terms: | L/C, T/T |
| Supply Ability: | 550T Per Month |
| Name: | Electrolytic Copper Foils For PCB Phenolic Resin Board Epoxy Board | Package: | Standard Export Wooden Box |
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| Application: | Battery FPC FCCL PCB | Thickness: | 0.006mm |
| Alloy Or Not: | Non-alloy | Surface: | Single-polished;double-polished;Ni-coated |
| Material: | Red Copper, Pure Copper Foil | Processing Service: | Decoiling, Cutting |
| Chemical: | Cu Not Less Than 99.97% | Shape: | Strip Coil Roll |
| High Light: | 0.006mm Electrolytic Copper Foil,3oz Electrolytic Copper Foil,2oz Electrolytic Copper Foil |
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0.006mm Shielding CCL / PCB Electrolytic Copper Foil
Description:
Electrolytic copper foil is an important material for the manufacture of copper clad laminates (CCL) and printed circuit boards (PCBs) and lithium ion batteries. In the rapid development of today's electronic information industry, electrolytic copper foil is called the "neural network" of electronic product signal and power transmission and communication. Since 2002, the production value of China's printed circuit boards has entered the third place in the world. As the substrate material for PCBs, CCL has also become the third largest producer in the world.
Electrolytic copper foil production process is simple, the main process has three: solution foil, surface treatment and product slitting. Its production process seems simple, but it is a combination of electronics, machinery and electrochemistry, and it is a production process that requires particularly strict production environment.
Features:
1. the treated foil in gray or red
2. High peel strength
3. Good etch ability
4. Excellent adhesion to etching resist
Application:
1. Phenolic resin board
2. Epoxy board
Typical properties of Standard copper foil
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Classification
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Unit | Requirement | Test Method | |||||||||||
| Foil Designation | / | T | H | M | 1 | 2 | 3 | IPC-4562A | ||||||
| Nominal thickness | / | 12um | 1/2 OZ | 3/4 OZ |
1 OZ |
2 OZ |
3 OZ |
IPC-4562A | ||||||
| Area Weight |
g/m2
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107±4 | 153±5 | 228±8 | 285±10 | 580±15 | 860±20 |
IPC-TM-650 2.2.12.2 |
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| Purity | % | ≥99.8 |
IPC-TM-650 2.3.15 |
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| Foil Profile | Shiny side (Ra) | um | ≤0.4 | ≤0.4 | ≤0.4 | ≤0.4 | ≤0.4 | ≤0.4 |
IPC-TM-650 2.3.17 |
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| Matte side(Rz) | um | ≤6 | ≤8 | ≤10 | ≤10 | ≤15 | ≤20 | |||||||
| Tensile Strength |
R.T.(23℃)
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Mpa | ≥150 | ≥220 | ≥235 | ≥280 | ≥280 | ≥280 |
IPC-TM-650 2.3.18 |
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| Elongation |
R.T.(23℃)
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% | ≥2 | ≥3 | ≥3 | ≥4 | ≥4 | ≥4 |
IPC-TM-650 2.3.18 |
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| Subject | Ω.g/m2 | ≤0.170 | ≤0.166 | ≤0.162 | ≤0.162 | ≤0.162 | ≤0.162 |
IPC-TM-650 2.5.14 |
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| Peel Strength(FR-4) | N/mm | ≥1.0 | ≥1.3 | ≥1.6 | ≥1.6 | ≥2.1 | ≥2.1 |
IPC-TM-650 2.4.8 |
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| Pinholes&porosity | Number | No |
IPC-TM-650 2.1.2 |
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| Anti-oxidization | R.T.(23℃) | day | 180 | / | ||||||||||
| H.T.(200℃) | Minutes | 60 | / | |||||||||||
1. Standard Width,1295(±1)mm,May according to the customer request tailor.
2. We test the peel strength with FR-4(Tg140) prepreg ,please reconfirm with your pp.
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