Place of Origin: | China |
Brand Name: | OEM |
Certification: | ISO / SGS / RoHS |
Minimum Order Quantity: | 50kg |
---|---|
Price: | Negotiable |
Packaging Details: | Exporting Wooden Case |
Delivery Time: | 10 - 15 Days |
Payment Terms: | L/C, T/T |
Supply Ability: | 550T Per Month |
Structure: | Sn | Cu | Temper: | Customized(Soft/Quarter Hard/Half Hard/Hard) |
---|---|---|---|
Thickness: | 0.012mm~0.15mm (0.00047inches~0.0059inches) | Shape: | Roll |
Craft: | Tinned | Width: | ≤600mm (≤23.62inches) |
Name: | Tin Plated Copper Foil | Tin Layer Thickness: | ≥0.3µm |
Adhesion: | 5B | Surface Resistance Of Tin Layer: | 0.3~0.5Ω |
High Light: | Single Side Tin Plated Copper Foil,600mm Tin Plated Copper Foil,0.15mm Tin Plated Copper Foil |
Anti Oxidizing Width 600mm Single Side Tin Plated Copper Foil
1. Description
Copper product is easy to oxidation when expose in the air and form verdigris. Verdigris can cause large resistance, poor conductivity and power transmission loss. Tin plated copper product due to tin itself characteristics can form stannic oxide thin films to prevent further oxidation. Tin can also form a similar film in halogens so that the tin plated copper product has well corrosion resistance and weldability. At the same time, tin plated copper product has a certain degree of strength and hardness. So it is widely used in electrical and electronic industry product.
Due to the non-toxic and tasteless of tin, tin product is widely used in the food industry, too.
2. Base Material:
High-precision Rolled Copper Foil, Cu(JIS: C1100/ASTM: C11000) content more than 99.96%
3. Base Material Thickness Range:
0.012mm~0.15mm (0.00047inches~0.0059inches)
4. Base Material Width Range:
≤600mm (≤23.62inches)
5. Specification
Items | Weldable Tin Plating | Non-weldable Tin Plating |
Width Range | ≤600mm (≤23.62inches) | |
Thickness Range | 0.012~0.15mm (0.00047inches~0.0059inches) | |
Tin layer Thickness | ≥0.3µm | ≥0.2µm |
Tin Content of Tin Layer | 65~92%(Can adjust tin content according to customer welding process) | 100% Pure Tin |
Surface Resistance of Tin Layer (Ω) | 0.3~0.5 | 0.1~0.15 |
Adhesion | 5B | |
Tensile Strength | Base Material Performance Attenuation after Plating ≤10% | |
Elongation | Base Material Performance Attenuation after Plating ≤6% |
High Purity Soft 10um Conductive Copper Foil Rolls
10 Micron Pure Electrolytic Thin Copper Foil
C11000 Insulation Transformer PCB Copper Foil
| Sitemap