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C11000 PCB Copper Foil

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C11000 PCB Copper Foil

China C11000 PCB Copper Foil supplier
C11000 PCB Copper Foil supplier C11000 PCB Copper Foil supplier

Large Image :  C11000 PCB Copper Foil

Product Details:

Place of Origin: China
Brand Name: OEM
Certification: ISO / SGS / RoHS

Payment & Shipping Terms:

Minimum Order Quantity: 50kg
Price: Negotiable
Packaging Details: Exporting Wooden Case
Delivery Time: 10 - 15 Days
Payment Terms: L/C, T/T
Supply Ability: 550T Per Month
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Detailed Product Description
Application: Relay Parts Thickness: 0.035- 2.5mm
Width: 7--610mm Material: Red Copper
Grade: Pure Copper Cu (Min): 99.90%
Alloy Or Not: Non-alloy Name: C11000 Red Copper Strip
Shape: Customised Color: Red
Type: Flat Length: Customer's Demands
Electric 20 CConductivity: C11000 >97%
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GB/TDINENASTM
TU2E Cu58Cu ETPC11000

 
 
Material introduction:C11000(Cu ETP)
 
         Cu ETP  is  an  electrolytically  refined oxygen-containing copper.  It has good electrical conductivity but compared with other high conductivity copper due to the high residua oxygen content of the alloy  it is  not suitable  for  processing (annealing welding etc.) and use in high temperature   ( temperature  greater  than  370 ° C )  reducing  gas.  Because  it  is  prone  to hydrogen  embrittlement  when the material  is heated to 600 ° C or  higher the oxygen inside the material  will form  water vapor  with the hydrogen in the air causing the  internal structure of the material to be brittle and cremated so hydrogen embrittlement occurs.
 
Material Features:
 
1. Cu copper content is greater than 99.9% oxygen content 5-40 PPM
2. Compared with oxygen-free copper C10200 OFC the processing cost is lower.
3. Not suitable for use at temperatures above 370 ° C prone to hydrogen embrittlement
4. Widely used in electronic parts of electrical components, electrical products
 
Physical properties
 

Density(g/cm3)

           8.9

Electrical conductivity{IACS%(20℃)}

           100

Modulus of elasticity(KN/mm2)

         127

 Thermal conductivity{W/(m*K)}

           394

 Coefficient of thermal expansion (10-6/℃ 20/℃~100/℃)

         17.7 

 
 Mechanical Properties 
 

Temper

Tensile Strength

Elongation A50

Hardness

     (Rm,Mpa)

                  %

HV

0

           195min                 35min          60max

1/4H

           215-255                  25min          55-100

1/2H

           255-315                  15min          75-120 

H

           290min                  5min          80 

 
Chemical composition   

Cu≥99.90

O

0.005-0.040

 
Application
 
Conductive parts, exchanger coils, heat exchangers
 
 
 C11000 PCB Copper Foil 0
 

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