C11000 PCB Copper Foil

Place of Origin:China
Brand Name:OEM
Certification:ISO / SGS / RoHS
Minimum Order Quantity:50kg
Price:Negotiable
Payment Terms:L/C, T/T
Supply Ability:550T Per Month
Product Details
Highlight:

C11000 PCB Copper Foil

,

Pure PCB Copper Foil

,

C11000 Thin Copper Foil

Application: Relay Parts
Thickness: 0.035- 2.5mm
Width: 7--610mm
Material: Red Copper
Grade: Pure Copper
Cu (Min): 99.90%
Alloy Or Not: Non-alloy
Name: C11000 Red Copper Strip
Shape: Customised
Color: Red
Type: Flat
Length: Customer's Demands
Electric 20 CConductivity: C11000 >97%
Product Description

 C11000 PCB Copper Foil
 

GB/TDINENASTM
TU2E Cu58Cu ETPC11000

 
 
Material introduction:C11000(Cu ETP)
 
         Cu ETP  is  an  electrolytically  refined oxygen-containing copper.  It has good electrical conductivity but compared with other high conductivity copper due to the high residua oxygen content of the alloy  it is  not suitable  for  processing (annealing welding etc.) and use in high temperature   ( temperature  greater  than  370 ° C )  reducing  gas.  Because  it  is  prone  to hydrogen  embrittlement  when the material  is heated to 600 ° C or  higher the oxygen inside the material  will form  water vapor  with the hydrogen in the air causing the  internal structure of the material to be brittle and cremated so hydrogen embrittlement occurs.
 
Material Features:
 
1. Cu copper content is greater than 99.9% oxygen content 5-40 PPM
2. Compared with oxygen-free copper C10200 OFC the processing cost is lower.
3. Not suitable for use at temperatures above 370 ° C prone to hydrogen embrittlement
4. Widely used in electronic parts of electrical components, electrical products
 
Physical properties
 

Density(g/cm3)

           8.9

Electrical conductivity{IACS%(20℃)}

           100

Modulus of elasticity(KN/mm2)

         127

 Thermal conductivity{W/(m*K)}

           394

 Coefficient of thermal expansion (10-6/℃ 20/℃~100/℃)

         17.7 

 
 Mechanical Properties 
 

Temper

Tensile Strength

Elongation A50

Hardness

     (Rm,Mpa)

                  %

HV

0

           195min                 35min          60max

1/4H

           215-255                  25min          55-100

1/2H

           255-315                  15min          75-120 

H

           290min                  5min          80 

 
Chemical composition   

Cu≥99.90

O

0.005-0.040

 
Application
 
Conductive parts, exchanger coils, heat exchangers
 
 
 C11000 PCB Copper Foil 0
 

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